Global Technology - March 2019

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Hiroshima University, Japan’s National Institute of Information and Communications Technology, and Panasonic Corporation have jointly developed a terahertz transceiver chip that can transmit or receive digital data at 80 gigabits per second.  The transceiver was implemented using CMOS integrated circuit technology, which makes it easy to produce in large volume.  Details were presented at the International Solid-State Circuits Conference 2019 in San Francisco.

The terahertz band is expected to dominate future ultrahigh-speed wireless communications.  IEEE Standard 802.15.3d, published in October 2017, defines the use of the lower terahertz frequency range between 252 GHz and 325 GHz.  The Panasonic research group has developed the first a single-chip transceiver that achieves a communication speed of 80 Gbits/sec using this standard.

People talk a lot about technological singularity these days.  The main point of interest seems to be whether artificial superintelligence will appear at some point.  But a more meaningful question to ask is, “How we can keep the ever-accelerating technological advancement going that will be required to support it?”  That’s a prerequisite.  Advances are not only required in computational power, but also in communication speed and capacity within and between computers.  The singularity is a self-fulfilling prophecy.  It’s not something some genius out there will make happen all of a sudden. It is a distant outcome of development, like this transceiver chip, which we develop today and tomorrow.

References

IEEE International Solid-State Circuits Conference, March 7, 2019, “An 80Gb/s 300GHz-Band Single-Chip CMOS Transceiver,” by Sangyeop Lee, et al.  © 2019 IEEE. All rights reserved.

To view or purchase this article, please visit:
https://ieeexplore.ieee.org/document/8662314

IEEE International Solid-State Circuits Conference, February 5-9, 2017, “An 80Gb/s 300GHz-Band Single-Chip CMOS Transceiver,” by Kyoya Takano, et al.  © 2019 IEEE. All rights reserved.

To view or purchase this article, please visit:
https://ieeexplore.ieee.org/document/7870384

IEEE International Solid-State Circuits Conference, June...

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